期刊論文 | 研討會論文 | 專利 | 專書

期刊論文

1. Yeong-Jyh Lin, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, “Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing,” IEEE Transactions on CPMT, Vol. 1, Issue 11, pp. 1755 – 1760, 2011. (IF 2.2)
2. Su Xu, Hongwen Ren, Yeong-Jyh Lin, M. G. Jim Moharam, Shin-Tson Wu, and Nelson Tabiryan, “Adaptive liquid lens actuated by photo-polymer,” Optics Express 17, Issue 20, pp. 17590-17595, 2009. (IF 3.8)
3. S. Xu, Y.J. Lin, and S.T. Wu, “Dielectric liquid microlens with well-shaped electrode,” Optics Express 17, 10499-10505, June 22, 2009. (IF 3.8)
4. Y.J. Lin, K.M. Chen, and S. T. Wu, “Broadband and polarization-independent beam steering using dielectrophoresis-tilted prism,” Optics Express 17, pp. 8651-8656, 2009. (IF 3.8)
5. H. Ren, S. Xu, Y. J. Lin, and S. T. Wu, “Adaptive-focus lenses," Optics and Photonics News, pp. 42-47, October 2008.
6. Yeong-Jyh Lin and Sheng-Jye Hwang, “Static Analysis of the Die Picking Process,” IEEE Transactions on Electronics Packaging Manufacturing, Vol.28, No. 2, pp. 142-149, April 2005. (IF 0.8)
7. Yeong-Jyh Lin and Sheng-Jye Hwang, “Temperature Prediction of Rolling Tires by Computer Simulation,” Mathematics and Computers in Simulation, Vol. 67, Issue 3, pp.235-249, November 2004. (IF 4.6)

研討會論文

1. Y. J. Lin, C. C. Hsieh, C. H. Yu, C. H. Tung, and Doug C. H. Yu, “Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications,” IEEE 61st Electronic Components and Technology Conference (ECTC) 2011, FL, USA, 2011. (Oral)
2. Shu-Ching Ho, Hsiang-Ming Huang, Yi-Chang Lee, Yeong-Jyh Lin, and An-Hong Liu, “The study of laser repair through BCB passivation in flip chip technologies,” SMTA International 2007, Florida, October 7 - 11, 2007. (Oral)
3. Yi-Chang Lee, An-Hong Liu, Emerson Chiu, Vincent Tu, Yeong-Jyh Lin, Hsiang-Ming Huang, Shu-Ching Ho, Jui-Chieh Chiu, Chih-Ming Lin, and Yeong-Her Wang, “Electrical Characterization of TSOP II and FBGA Packages for High-Speed Applications,” SMTA International 2007, Orlando, Florida, October 7 - 11, 2007. (Oral)
4. G.S. Shen, Y.J. Lee, Yeong-Jyh Lin, Jian-Yu Chen, and Sheng-Jye Hwang, “Structure Deformation of Leadframe in Plastic Encapsulation,” International Microsystem, Packaging, Assembly and Circuits Technology (IMPACT) conference 2007, Taipei, Taiwan, October 1-3, 2007. (Oral)
5. J.Y. Chen, S.Y. Teng, S.J. Hwang, H.H. Lee, D.Y. Huang, Y.J. Lin, Stoke Chen, and G.S. Shen, “Prediction of Flow Induced Lead Deflection of Leadframe Assemblies in Plastic Encapsulation during Molding,” 8th International Conference on Electronic Package Technology, Shanghai, China, August 14-17, 2007.
6. Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, and Yeong-Jyh Lin, “Mold Adhesion Force Measurement,” InterPACK '07, Vancouver, BC, Canada, July 8-12, 2007.
7. Stoke Chen, G.S. Shen, J.Y. Chen, S.Y. Teng, S.J. Hwang, Y.J. Lin, H.H. Lee, and D.Y. Huang, “The Development of Paddle Shift Analysis for IC Packaging Processing,” 2007 International Symposium on High Design Packaging and Microsystem Integration, pp.76-80, Shanghai, China, June 2007.
8. 陳建羽, 鄧湘榆, 黃聖杰李輝煌;黃登淵;林勇志,"利用田口方法進行IC封裝翹曲之分析模擬",2007 Modex-3D Users’ Meeting-Taiwan, 2007.
9. Yeong-Jyh Lin and Sheng-Jye Hwang, “Taguchi Analysis of Die Crack Simulation of III-V IC Pick Up Process,” Semicon Taiwan 2003, Taipei September 2003.
10. Y.J. Lin, H.H. Lee, S.J. Hwang, and D.Y. Huang, “A Method to Evaluate Temperature Distribution on A Pneumatic Tire Due to Hysteresis Effect,” The 8th Taiwan ANSYS User Conference, November 2002. (In Chinese)
11. Yeong-Jyh Lin, Huei-Huang Lee, Sheng-Jye Hwang, and Durn-Yuan Hwang, “Solder Ball Reliability of a CSP Under TCT Loading,” 6th Taiwan ANSYS User Conference, Grand Formosa Taroko Hotel, Hualien, November 2000.

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