115學年度《先進半導體封測研究所》外國學生招生(申請期間:2026 年 1 月 15 日至 3 月 15 日)
The Office of International Affairs at NSYSU has released the 2026 Fall (Academic Year 115) International Student Admission Guidelines.
Institute of Advanced Semiconductor Packaging and Testing-International Master Program (2 years):
◎Research Fields:
1.Electronics 2. Semiconductor 3. Device 4. Control 5. Communication 6. Thermal-fluid 7. Solid Mechanics 8. Design and Manufacturing 9. Micro/Nano Systems 10. Material Science and Engineering 11. Polymer Science 12. Chemistry and chemical engineering 13. Photonic materials and devices.
◎Study Subsidy: During the two-year study period, the partner enterprise will provide each international student with a study subsidy totaling approximately NTD 430,000, which includes:
⚫A monthly living allowance of NTD 10,000.
⚫A monthly housing allowance of NTD 3,000.
⚫A tuition and miscellaneous fees subsidy of approximately NTD 120,000 for the two-year period. Additionally, the institute will waive tuition and miscellaneous fees, valued at approximately NTD 120,000 over two years.
During the second year of the master’s program, international students may be offered up to 40 hours per month of part-time work opportunities by the partner enterprise.
Fresh graduates must work in the cooperative enterprise for at least 2 years.
Upon receiving admission notification, each international student must sign and submit the
"Agreement on Study Subsidy Disbursement and Repayment, and Post-Graduation Employment Service" to complete the enrollment process. For other details, please refer to the official admission guidelines.
Apply Now and Join Our International Program!![]()
Admission Information:
Application Period:January 15 – March 15, 2026
Admission Results:Before June 5, 2026
Semester Begins:Mid-September 2026
Admission Guidelines:https://reurl.cc/rKOvk1 (Details are subject to the admission guidelines p.169)
We look forward to receiving your application. If you have any questions, please feel free to contact us:sat@mail.nsysu.edu.tw
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