1

R. C. Lin, K. S. Kao, and Y. C. Chen, 2007, “Two-step Sputtered ZnO Piezoelectric Films for Film Bulk Acoustic Resonators”, Applied Physics A: Materials Science & Processing, 89, 475 2007. (Impact Factor=2.9)

2

R. C. Lin, K. S. Kao, C. C. Cheng, and Y. C. Chen, “Deposition and structural properties of R.F. magnetron sputtered ZnO thin films on Pt/Ti/SiNx/Si substrate for FBAR device”, Thin Solid Film, 516/16, 5262 2008. (Impact Factor=2)

3

R. C. Lin, Y. C. Chen, C. C. Cheng, K. S. Kao, “Highly-Sensitive Mass Sensor using Film Bulk Acoustic Resonator”, Sensors and Actuators A, 147, 425 2008. (Impact Factor=4)

4

H.K. Lin, R.C. Lin, C.H. Li “Etching processes of transparent carbon nanotube thin films using laser technologies” , Thin Solid Film, 518/24, 7253 2010. (Impact Factor=2)

5

W. T. Chang, Y. C. Chen, R. C. Lin, C. C. Cheng, K. S. Kao and Y. C. Huang “Wind power generators based on ZnO piezoelectric thin films on stainless steel substrates”, Current Applied Physics, 11, 333 2010. (Impact Factor=3.1)

6

R. H. Horng, H. L. Hu, R. C. Lin, K. C. Peng, and Y. C. Chiang “Thermal Behavior of Sapphire-Based InGaN Light-Emitting Diodes with Cap-Shaped Copper-Diamond Substrates”, Electrochemical and Solid-State Letters, 14, H215, 2011. (Impact Factor=2.321)

7

W. T. Chang, Y. C. Chen, R. C. Lin, C. C. Cheng, K. S. Kao, B. R. Wu, Y. C. Huang, “Design and fabrication of a piezoelectric transducer for wind-power generator” Thin Solid Film, 519, 4687 2011. (Impact Factor=2)

8

R. H. Horng, H. L. Hu, R. C. Lin, and Y. C. Chiang “High Thermal Dissipation Apparatus for UV LEDs Application”, Journal of the electrochemical society, 35, 6, 2011. (Impact Factor=3.1)

9

R. H. Horng, R. C. Lin, and H. L. Hu, “Diamond-added-copper (DAC) heat spreader for UV LED application”, Electrochemical and Solid-State Letters, 14, H453 2011. (Impact Factor=2.321)

10

R. H. Horng, R. C. Lin, Y. C. Chiang, B. H. Chuang, H. L. Hu, and C. P. Hsu, “Failure Modes and Effects Analysis for High-Power GaN-Based Light-Emitting Diodes Package Technology” Microelectronics Reliability, 55, 818, 2012. (Impact Factor=1.9)

11

R. H. Horng, H. L. Hu, S. L. Ou, R. C. Lin, and, C. P. Hsu, “Enhancement of light extraction for InGaN light emitting diodes by beveled sapphire and cup-shaped copper sheeting”, IEEE Photonics Technology Letters, 24, 1421, 2012.  (Impact Factor=2.5)

12

R. H. Horng, H. L. Hu, R. C. Lin, L. S. Tang, C. P. Hsu and S. L. Ou “Cup-shaped copper heat spreader in multi-chip high-power LEDs application”, Optics Express, 20, A597, 2012. (Impact Factor=3.3)

13

Y.-J. Tsai, R. C. Lin*, H.-L. Hu, C.-P. Hsu, S.-Y. Wen and C.-C. Yang, “A Novel Electrode Design for Integrated Thin Film GaN LED Package with Efficiency Improvement” IEEE Photonics Technology Letters, 6, 609, 2013. (Impact Factor=2.5，)

14

S.-Y. Wen, H.-L. Hu, Y.-J. Tsai, C.-P. Hsu, R.  C. Lin and R. H. Horng, “A Novel Integrated Structure of Thin Film GaN LED with Ultra-Low Thermal Resistance” Optics Express, 22, A601, 2014. (Impact Factor=3.3)

15

C. C. Cheng, R. C. Lin, H. K. Lin, K. S. Kao and Y. C. Chen, “Frequency Modulation and Device Repaired by Laser Surface Treatment in Film Bulk Acoustic Filters,” Journal of Laser Micro/Nanoengineering, 11(1), pp. 13-16, Feb. 2016. (Impact Factor=0.9)

16

H. K. Lin, S. Z. Hong, B. F. Chung and R. C. Lin, “Characterization of local laser bonding quartz to anodic aluminum oxide in light emission device,” Optical and Quantum Electronics, 49(7), p. 172, 2017. (Impact Factor=4.0)

17

Q. W. Yang, R. C. Lin*, S. J. Sun, “Influence of AlN/ScAlN piezoelectric multilayer on the electromechanical coupling of FBAR”, Micro and Nanostructures, 174, p. 2017427, 2023. (Impact Factor=3.0)

18

D. Zhang, Z. Y. Chen, R. C. Lin*, & S. J. Sun. “Reliable formulas for accurately determining the resonance and antiresonance frequencies of thin film bulk acoustic resonators”. Physica Scripta, 99, 055920. (2024, Apr). (Impact Factor=2.6)

19

R. C. Lin, D. Zhang, W. S. Huang, Z. Y. Chen, and S. J. Sun. “Effect of phase correction produced by trimming layer on thin film bulk acoustic resonator”. Journal of Applied Physics, 136, 034503. (2024, Jul). (Impact Factor= 2.5)

20

R. C. Lin* & S. J. Sun. “Reduction of TCF effect in FBAR devices using DC bias”. Applied Physics Letters, 125, 172201. (2024, Oct) (Impact Factor= 3.6)

21

R. C. Lin, and S. J. Sun, “Graded Sc-doped AlN Structures for Residual Stress Suppression and Bandwidth Improvement in FBAR Filters”, Applied Physics A (Materials), 131, 711, (2025, July)  (Impact Factor=2.9)

22

S. J. Sun, and R. C. Lin. “Topological effect Design for Enhancing Solidly Mounted Resonators Performance”, Journal of Applied Physics, 138, 9, 2025, (Impact Factor=2.5)

23

Re‑Ching Lin, Chien‑Chuan Cheng and Shih‑Jye Sun, “Optimizing Sc‑Doped AlN FBARs for Wideband Performance in Sub‑3 GHz RF Filters” Journal of Electronic Materials, 2025, (Impact Factor=2.5)

1

R. C. Lin, B. R. Wu, Y. C. Chen, C. C. Cheng and K. S. Kao, “The power generator using ZnO film on flexible substrate”, The International Conference on Technological Advances of Thin Films & Surface Coatings, FPT4583, Singapore, July. 13-16, 2008.

2

R. C. Lin, Y. C. Chen, C. W. Deng, C. C. Cheng and K. S. Kao, “Influence of postdeposition annealing on the characteristic of ZnO-based FBAR”, The International Conference on Technological Advances of Thin Films & Surface Coatings, FPT4149, Singapore, July. 13-16, 2008.

3

R. C. Lin, C. C. Cheng, K. S. Kao, H. K. Lin, D. L. Cheng, and J. B. Shi, “Room Temperature Fabrication of Rutile TiO2 Nano Powder Using Laser Ablation”, 6th International Symposium on Transparent Oxide Thin Films for Electronics and Optics, A115, 16 p.112, April 15-17, 2009

4

R. C. Lin, Y. C. Chen, C. W. Deng, C. C. Cheng and K. S. Kao, “The Effects of Top Electrode Materials on the Characteristics of FBARs”, Symposium on Nano Device Technology, 2009

5

H. K. Lin and R. C. Lin*, “Laser addressing in Cholesteric Liquid Crystal Display”, 10^th International Symposium on Laser Precision Microfabrication, P00093, June 29 – July 2, 2009

6

C. C. Cheng, R. C. Lin*, Y. C. Chen, “Temperature Characteristics and Electromechanical Coupling Coefficient for SAW in Annealed Proton-Exchanged LiNbO3 Waveguides” The International Conference on Advances of Thin Films and Coatings (ThinFilms2010), FPT4095, Harbin, July 11-14, 2010.

7

C. Y. Chen, R. H. Horng, R. C. Lin, D. S. Wuu, H. L. Hu and C. P. Hsu, “Design for High-Power LEDs Array Module Using Copper Heat Spreader with Reflector”, International Electron Devices and Materials Symposium(IEDMS 2010), Kuva Chateau, Chungli, Taiwan, November 18-19, 2010.

8

J. S. Hong, R. H. Horng, R. C. Lin, Y. C. Chiang and B. H. Chuang, “Promising Failure Modes and Effects Analysis for High-Power GaN-Based Light-Emitting Diodes Package Technology”, 2010 International Conference on Optics and Photonics in Taiwan (OPT 2010), Tainan, Taiwan, Southern Taiwan University, December 3-4, 2010.

9

R. H. Horng, R. C. Lin, J. S. Hong, Y. C. Chiang and D. S Wuu, “High Thermal Dissipation Apparatus for UV LED Application” 2010 International Conference on Optics and Photonics in Taiwan (OPT 2010), Tainan, Taiwan, Southern Taiwan University, December 3-4, 2010.

10

S. L. Ou, P. C. Kuo, C. P. Cheng, F. S. Hsieh, K. S. Kao, S. C. Chen and R. C. Lin, “Effect of film thickness on the crystallization kinetics and optical properties of GeCu films” 2011 AVS international plasma workshop, Taipei, Taiwan, March 22-25, 2011.

11

R. H. Horng, J. H. Lin, R. C. Lin, D. S Wuu, K. C. Shen “High-voltage thin GaN LEDs array” SPIE Proceedings Vol. 8262, 46, 2012.

12

R. C. Lin*, S. J. Sun, C. C. Cheng, F. Xu and J. J. Liao. “Advanced Ultra-Thin Wafer Level Packaging of Bulk Acoustic Wave Filters for RF Front-End Module Integration”. EDMS & SNDCT (2024, Aug)

1

Yao-Jun Tsai, Chen-Peng Hsu, Shih-Yi Wen, Chi-Chin Yang, Yu-Hsiang Chang, Re-Ching Lin, Hung-Lieh Hu

Light emitting diode

US-9391239-B2

2016/7/12

2

Shu-Hsiao TSAI, Re Ching LIN, Pei-Chun Liao, Cheng-Kuo Lin, Yung-Chung Chin

Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device

US-9998087-B2

2018/6/12

3

Shu-Hsiao TSAI, Re Ching LIN, Pei-Chun Liao, Cheng-Kuo Lin, Yung-Chung Chin

Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereof

US-9653516-B2

2017/5/16

4

Re-Ching Lin, Pei-Chun Liao

Acoustic wave device and manufacturing method thereof

EP-3675357-B1

2022/8/24

5

Re-Ching Lin, Pei-Chun Liao

Acoustic wave device and fabrication method thereof

US-11362633-B2

2022/6/14

6

Shu-Hsiao TSAI, Re Ching LIN, Pei-Chun Liao, Cheng-Kuo Lin, Yung-Chung Chin, Chih-Feng Chiang

Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereof

US-9905610-B2

2018/2/27

7

Chia-Ta Chang, Re Ching LIN, Yung-Chung Chin, Chih-Feng Chiang

Resonance structure of bulk acoustic wave resonator

US-10097156-B2

2018/10/9

8

Re Ching LIN, Fan Hsiu Huang, Tung-Yao Chou, Cheng Kuo Lin, Shu Hsiao Tsai, Chih-Feng Chiang

Thermal sensor circuit

US-10103624-B2

2018/10/16

9

Re Ching LIN, Shu Hsiao Tsai, Cheng Kuo Lin, Fan Hsiu Huang, Chih-Feng Chiang, Tung-Yao Chou

Thermal sensing acoustic wave resonator and acoustic wave filter having thermal sensing acoustic wave resonator

US-10727741-B2

2020/7/28

10

Re Ching LIN, Shu Hsiao Tsai, Cheng Kuo Lin, Chih-Feng Chiang, Fan Hsiu Huang, Tung-Yao Chou

Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereof

US-10756625-B2

2020/8/25

11

Cheng-Kuo Lin, Shu-Hsiao TSAI, Rong-Hao SYU, Yi-Ling Liu, Re-Ching Lin, Pei-Chun Liao

Protective cover for an acoustic wave device and fabrication method thereof

US-10498310-B2

2019/12/3

12

Pei-Chun Liao, Po-Wei Ting, Chih-Feng Chiang, Yu-Kai WU, Yu-Fan Chang, Re-Ching Lin, Shu-Hsiao TSAI, Cheng-Kuo Lin

Protection structure for semiconductor device package

US-10453805-B2

2019/10/22

13

Ying-Chung Chen, Chien-chuan Cheng, Wei-Tsai Chang, Kuo-Sheng Kao, Re-Ching Lin, Jia-Ming Jiang, Chun-Hung Yang

Quantitative sensor and manufacturing method thereof

US-9140671-B2

2015/9/22

14

Wei Dong, Re-Ching Lin, Pei-Chun Liao

MEMS device and fabrication method thereof

US-11130671-B2

2021/9/28

15

Re-Ching Lin, Shih-Yi Wen, Chen-Peng Hsu, Hung-Lieh Hu, Yu-Chen Yu, Chia-Fen Hsieh

Light emitting diode package structure

US-9231168-B2

2016/1/5

16

Wei Dong, Re-Ching Lin, Pei-Chun Liao

Mems device and fabrication method thereof

EP-3730454-B1

2022/1/26

17

Pei-Chun Liao, Re-Ching Lin, Junwu Zhao

Film bulk acoustic resonator

US-11539340-B2

2022/12/27

18

Shu Hsiao Tsai, Re Ching Lin, Pei Chun Liao, Cheng Kuo Lin, Yung Chung Chin, Chih Feng Chiang

Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereof

TW-I679747-B

2019/12/11

19

Ying Chung Chen, Re Ching Lin, Kuo Sheng Kao, Chien Chuan Cheng, Hsiung Chou

Piezoelectric generator having a composite piezoelectric structure

TW-I374607-B

2012/10/11

20

Re Ching Lin

Preparation method of epitaxial substrate

TW-I474381-B

2015/2/21

21

Ying Chung Chen, Re Ching Lin, Wei Tsai Chang, Kuo Sheng Kao, Chien Chuan Cheng, Bing Rung Wu

Piezoelectric transducer

TW-I412223-B

2013/10/11

22

Chen Peng Hsu, Re Ching Lin, Yao Jun Tsai, Yun Sheng Ku, Shih Yi Wen

Led wafer and manufacturing method thereof

TW-I513051-B

2015/12/11

23

Ying Chung Chen, Re Ching Lin, Wei Tsai Chang, Kuo Sheng Kao, Chien Chuan Cheng

Piezoelectric generator with a composite piezoelectric structure

TW-I469495-B

2015/1/11

24

Ying Chung Chen, Re Ching Lin, Wei Tsai Chang, Kuo Sheng Kao, Chien Chuan Cheng, Bing Rung Wu

Piezoelectric transducer with a composite piezoelectric structure

TW-I422082-B

2014/1/1

25

Kuo Sheg Kao, Chih Ming Wang, Po Tsung Hsieh, Re Ching Lin, Huai Shan Chin, Chuan Cheng Chien, Da Long Cheng

A display device having an ultraviolet light barrier layer

TW-I401993-B

2013/7/11

26

Ying Chung Chen, Re Ching Lin, Kuo Sheng Kao, Chien Chuan Cheng

Method for manufacturing film bulk acoustic resonator

TW-I334271-B

2010/12/1

27

Pei-Chun Liao, Po-Wei Ting, Chih-Feng Chiang, Yu-Kai WU, Yu-Fan Chang, Re-Ching Lin, Shu-Hsiao TSAI, Cheng-Kuo Lin

Protection structure for semiconductor device package

US-10298203-B2

2019/5/21

28

Ying Chung Chen, Kuo Sheng Kao, Re Ching Lin, Ching Liang Wei, Chien Chuan Cheng, Hsiung Chou, Wei Tsai Chang

Film buck acoustic resonator and manufacturing method thereof

TW-I449332-B

2014/8/11

29

Ying Chung Chen, Hsiung Chou, Chien Chuan Cheng, Kuo Sheng Kao, Re Ching Lin, Ching Liang Wei, Wei Tsai Chang

Film bulk acoustic resonator and manufacturing method thereof

TW-I440302-B

2014/6/1

30

Ying Chung Chen, Re Ching Lin, Kuo Sheng Kao, Da Long Cheng, Hsuan Kai Lin, Sung Ho Liu, Chien Chuan Cheng

Method for manufacturing film buck acoustic resona

TW-I360902-B

2012/3/21

31

Re Ching Lin

Preparation method and product of vertical conduction type light emitting diode

TW-I460891-B

2014/11/11

32

Chih Ming Wang, Kuo Sheg Kao, Po Tsung Hsieh, Re Ching Lin, Huai Shan Chin, Chuan Cheng Chien

A display device having a photochromic unit

TW-I395508-B

2013/5/1

33

Ying Chung Chen, Re Ching Lin, Wei Tsai Chang, Kuo Sheng Kao, Chien Chuan Cheng, Jia Ming Jiang

Fluid sensor and manufacturing method thereof

TW-I507683-B

2015/11/11