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The Graduate Institute of Advanced Semiconductor Packaging and Testing (ASPT) at National Sun Yat-sen University is committed to advancing education and research in semiconductor packaging and testing technologies. Through interdisciplinary education, cutting-edge research, and close collaboration with leading semiconductor companies, ASPT integrates academic learning with industry practice to cultivate future talent for the global semiconductor industry.

The institute offers both Domestic and International Programs. Supported by industry-sponsored study subsidies and strong industry-academia partnerships, students receive financial support, practical training opportunities, and valuable industry experience throughout their studies. Upon graduation, students are expected to fulfill a two-year employment commitment with participating partner companies, further strengthening the connection between academic training and industry development.

Mechanism for the Disbursement and Return of Study Subsidies for International Program Students of the Graduate Institute of Advanced Semiconductor Packaging and Testing

► [Applicable to international students admitted from Academic Year 2026 onward]

Curriculum Structure of Advanced Semiconductor Packaging and Testing【International Program】

► Applicable to students enrolling in September, 2026