Curriculum Structure of Advanced Semiconductor Packaging and Testing

Semester	One‑out‑of‑two Compulsory Courses on Each Semester for Grad 1 Students		Two‑out‑of‑eight Elective Courses on Each Semester for Grad 1 Students
First Semester	Semiconductor Manufacturing Technology		Applied Mechanics and Mechanics of Materials	Intelligent Manufacturing and Control Practices		Materials Science
	Semiconductor Manufacturing Technology		Polymer Materials	Selected Topics on MEMS Devices and Technology		System-level Static Electricity and Electromagnetic Interference
	Essential Knowledge for Semiconductor Engineers		Polymer Materials	Selected Topics on MEMS Devices and Technology
	Essential Knowledge for Semiconductor Engineers		Microwave Circuit and System	Product Analysis
Second Semester	Design and Testing for System Circuit		Electrical Measurement and Analysis of Semiconductor Devices	Application of Laser Micro-Micromachining in Electronic Packaging		High-Speed and High Frequency Circuit Simulation and Measurement
	Design and Testing for System Circuit		Image Recognition	Organic Semiconductor Materials and Devices		Engineering Statistics and Quality Management
	Structural Design and Process of Advanced Electronic Packaging Technology		Image Recognition	Organic Semiconductor Materials and Devices		Engineering Statistics and Quality Management
			Semiconductor Optoelectronics	Quality System and Quality Improvement
Program		27 Credits of Compulsory Internship Courses Delivered for Grad 1 to 3 Students			Notes
Internship in the Institute of Advanced Semicondu-ctor Packaging and Testing		Grad 1：Semiconductor Process and Development Tendency, Applied Statistics Grad 2：Problem Analysis and Solving Tools, Professional Courses and Applications (Level 1) - Professional Teaching, Five Core Tool Applications, Professional Courses and Applications (Level 2) - Project Planning and Execution, ATV Device Practice Grad 3：Professional Courses and Applications (Level 3) - Acceptance and Planning / Project Reporting（I）, Professional Courses and Applications (Level 3) -Acceptance and Planning / Project Reporting（II）			Two out of Four Courses for Grad 1 on the Second Semester Five Courses for Grad 2 (Two for Each Semester and One for Summer Semester One Course on Each Semester for Grad 3 Three Credits for Each Course

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Curriculum Structure of Advanced Semiconductor Packaging and Testing